Course Details

Course Information

Semester	Course Unit Code	Course Unit Title	T+P+L	Credit	Number of ECTS Credits	Last Updated Date
1	EE486	SEMICONDUCTOR PROCESS AND DEVICE FABRICATION	3+0+0	3	5	15.05.2026

Course Details

Language of Instruction	English
Level of Course Unit	Bachelor's Degree
Department / Program	ELECTRICAL-ELECTRONICS ENGINEERING
Type of Program	Formal Education
Type of Course Unit	Elective
Course Delivery Method	Face To Face
Objectives of the Course	This course introduces the fundamentals of microfabrication process and reviews the developments, materials and cleanroom protocols.
Course Content	The topics are photolithography, masking and patterning of materials, oxidation and diffusion, ion implantation, thermal processing, etching, metal and dielectric deposition for contacts, gate and interconnect engineering, metrology and process control systems, packaging, MEMS devices.
Course Methods and Techniques
Prerequisites and co-requisities	None
Course Coordinator	Asist Prof.Dr. DOOYOUNG HAH dooyoung.hah@agu.edu.tr
Name of Lecturers	Asist Prof.Dr. DOOYOUNG HAH
Assistants	None
Work Placement(s)	No

Recommended or Required Reading

Resources

Planned Learning Activities and Teaching Methods

Activities are given in detail in the section of "Assessment Methods and Criteria" and "Workload Calculation"

Assessment Methods and Criteria

In-Term Studies	Quantity	Percentage
Yarıl yılSonu Sınavı/Dönem Projesinin Başarı Notuna Katkısı	1	% 35
Ödev	5	% 10
Sunum/Seminer	1	% 20
Final examination	1	% 35
Total	8	% 100

ECTS Allocated Based on Student Workload

Activities	Quantity	Duration	Total Work Load
Yazılı Sınav	1	20	20
Ev Ödevi	5	2	10
Sınıf İçi Aktivitesi	5	1	5
Sunum için Hazırlık	1	20	20
Sunum	1	1	1
Okuma	5	3	15
Araştırma	5	2	10
Yüz Yüze Ders	14	3	42
Final Sınavı	1	20	20
Total Work Load			Number of ECTS Credits 5 143

Course Learning Outcomes: Upon the successful completion of this course, students will be able to:

No	Learning Outcomes
1	Understand basic principles as well as technical details of various semiconductor processes
2	Design specific processes based on their mathematical models
3	Design fabrication process flows for given materials and constraints

Weekly Detailed Course Contents

Week	Topics	Study Materials	Materials
1	Introduction
2	Crystal
3	Lithography
4	Oxidation
5	Diffusion
6	Ion implantation
9	Physical vapor deposition
10	Chemical vapor deposition
11	Wet etching
12	Dry etching
13	CMOS process
14	Presentation

Contribution of Learning Outcomes to Programme Outcomes

Contribution: 1: Very Slight 2:Slight 3:Moderate 4:Significant 5:Very Significant

https://sis.agu.edu.tr/oibs/bologna/progCourseDetails.aspx?curCourse=79022&lang=en