Semester | Course Unit Code | Course Unit Title | T+P+L | Credit | Number of ECTS Credits |
1 | ECE686 | SEMICONDUCTOR PROCESS AND DEVICE FABRICATION | 3+0+0 | 3 | 7,5 |
Language of Instruction
|
English
|
Level of Course Unit
|
Master's Degree
|
Department / Program
|
ELECTRICAL AND COMPUTER ENGINEERING
|
Type of Program
|
Formal Education
|
Type of Course Unit
|
Elective
|
Course Delivery Method
|
Face To Face
|
Objectives of the Course
|
1. To learn basic principles of various semiconductor processes.
2. To obtain technical details of device fabrication processes.
3. To gain knowledge in relevant cutting-edge technologies.
|
Course Content
|
Semiconductor basics
CMOS process flow
Crystal
Lithography
Oxidation
Dopant introduction
Thin film deposition
Etching
MEMS fabrication
Cutting-edge fabrication technologies LO3, LO4
|
Course Methods and Techniques
|
|
Prerequisites and co-requisities
|
None
|
Course Coordinator
|
None
|
Name of Lecturers
|
Asist Prof.Dr. DOOYOUNG HAH dooyoung.hah@agu.edu.tr
|
Assistants
|
None
|
Work Placement(s)
|
No
|
Recommended or Required Reading
|
Planned Learning Activities and Teaching Methods
Activities are given in detail in the section of "Assessment Methods and Criteria" and "Workload Calculation"
Assessment Methods and Criteria
ECTS Allocated Based on Student Workload
Course Learning Outcomes: Upon the successful completion of this course, students will be able to:
Weekly Detailed Course Contents
Contribution of Learning Outcomes to Programme Outcomes
Contribution: 1: Very Slight 2:Slight 3:Moderate 4:Significant 5:Very Significant
https://sis.agu.edu.tr/oibs/bologna/progCourseDetails.aspx?curCourse=77788&lang=en